Laser Vision Measurement品管量測設備

產品特性（FEATUR）

◆使用Window’s視窗介面，中/英文化書面，操作簡單。

◆手動量測錫膏厚度

◆手動測量長、寬及兩錫膏間之距離（間距）

◆測量值可記錄存檔及列印

◆提供厚度分布統計圖表及X_Bar_R管制表

◆自動計算制程能力指標CP、CPK、

◆可依不同生產線分別作記錄

◆可依基板厚度調整焦距

◆可做定時呼叫取樣

◆All operations are easy and using Windows interface in Chine/English version.

◆Survey thickns of tin solder by auto matica lly or manually.

◆Survey the length and width manually,and the gap of tin solder.

◆Calculate the measure of area, the measure of cross-seion and the measure of volumn automatically.

◆All surveyed valu can be recorded to a file and be printed to a report.

◆Provide the diagrams of thickns distribution and control diagrams of X_BAR_R.

◆Calculate man faure ability degree automatically(CP, CPK, )

◆It can have proprietary record according to every different produion ling.

◆It can adjust focus point in different thickns of PC boards.

◆It can be called to sample periodically.

適用（APPLECATION）

◆各式厚度量測數值取得統計分析

◆錫膏印刷機制程品管檢查

◆錫膏印刷厚度良性測量

◆錫膏印刷成型，尺寸量測檢查

◆提供其他物品測厚，測長，量測檢查

◆Get the rults of statistics and ysis about all surveyed valu in every thickns degree.

◆Inspe the quality of solder printing procs.

◆Survey the thickns benignancy of tin solder

◆Measure the dimension of tin solder

◆Provide thickns and dimension measurement funion for other objes

功能（FUNION）

◆量測印刷錫膏厚度、長度、高度、間距。

◆提供厚度分布數值參考。

◆提供各種統計分析圖表

X管制圖、R管制圖、厚度列表

X平均值管制圖單點列表

◆Surveying the thickns of printing tin solder, length ,height and interval.

◆Provide the referenc of thickns distribution valu.

◆Provide the ysis of different measure of cross-seion.

◆Calculate the measure of area and volumn automatically in obje which to be surveyed.

◆Provide all diagrams of statistics and ysis.

Provide X control Diagram, R Control Diagram

and Thickns List Diagram. Provide X Average

Control Diagram, Single Point List Diagram.